公开(公告)号：US11967778B2

公开(公告)日：2024-04-23

申请号：US17536332

申请日：2021-11-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Heng Qu ,  Meijuan Fu ,  Liguo Zhang ,  Ying Kang

IPC: H01Q9/04 ,  H01Q1/24 ,  H01Q1/38

CPC classification number: H01Q9/0414 ,  H01Q1/243 ,  H01Q1/38

Abstract: This application provides a packaging structure, including an antenna in package and a radio frequency chip that are packaged together, where the antenna in package is fastened on the radio frequency chip. The antenna in package includes a radiator and at least two feeding parts, the at least two feeding parts are electrically connected to the radio frequency chip, the radio frequency chip is configured to receive or transmit a radio frequency signal, and at least one of the at least two feeding parts provides differential feeding for the radiator. This application further provides a network device and a terminal device, to reduce an antenna size and make the antenna easier to mount.