公开(公告)号：US20220319977A1

公开(公告)日：2022-10-06

申请号：US17843365

申请日：2022-06-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jinhan FAN ,  Yusong CHI ,  Nianyong ZHU

IPC: H01L23/528 ,  H01L23/58 ,  H01L23/00 ,  H01L23/64

Abstract: Example chip structures are described. One example chip structure includes a die, a first chip bond pad, and a second chip bond pad. A first radio frequency circuit, a second radio frequency circuit, a first interconnect metal wire, and a second interconnect metal wire are disposed in the die. The first interconnect metal wire is connected to the first radio frequency module, and is configured to provide an alternating current ground for the first radio frequency module. The second interconnect metal wire is connected to the second radio frequency module, and is configured to provide an alternating current ground for the second radio frequency module. The first chip bond pad and the second chip bond pad are disposed on a surface of the die.