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公开(公告)号：US20230061591A1
公开(公告)日：2023-03-02
申请号：US17756781
申请日：2021-02-01
Applicant: Hanon Systems
Inventor： Gero Lapp , Julian Neukirchen , Felix Girmscheid , Jihoon Choi , Florian Bieregger , Matthias Herpers
IPC: F28F3/04
Abstract: A heat exchanger with at least one plate includes main dimples between which secondary dimples are formed which are flatter and/or smaller with respect to their dimensions as seen in a plan view. A depth of the secondary dimples may be at most 0.5 times a channel height and/or at most 0.5 times the depth of the main dimples.
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