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    Microstructure and microstructure manufacture method
    1.
    发明授权
    Microstructure and microstructure manufacture method 有权
    微结构和微结构制造方法

    公开(公告)号：US07952033B2

    公开(公告)日：2011-05-31

    申请号：US12039186

    申请日：2008-02-28

    申请人： Yoshihiro Mizuno ,  Norinao Kouma ,  Hisao Okuda ,  Hiromitsu Soneda ,  Tsuyoshi Matsumoto ,  Osamu Tsuboi

    发明人： Yoshihiro Mizuno ,  Norinao Kouma ,  Hisao Okuda ,  Hiromitsu Soneda ,  Tsuyoshi Matsumoto ,  Osamu Tsuboi

    IPC分类号： H05K1/03

    CPC分类号： B81C1/00698 ,  Y10T29/49117

    摘要： A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face.

    摘要翻译： 微结构包括具有第一导体，第二导​​体和位于第一和第二导体之间的中间绝缘体的层压结构。 第一导体包括相对于第二导体的相对面，侧面和形成上述相对面和侧面的边界的边缘部分。 第二导体包括延伸超过超过第一导体的边缘部分的延伸面。 绝缘膜包括覆盖边缘部分的至少一部分和/或侧面的至少一部分的区域。

    Method of making microstructure device, and microstructure device made by the same
    2.
    发明授权
    Method of making microstructure device, and microstructure device made by the same 有权
    制造微结构器件的方法及其制造的微结构器件

    公开(公告)号：US07871687B2

    公开(公告)日：2011-01-18

    申请号：US11902011

    申请日：2007-09-18

    申请人： Norinao Kouma ,  Yoshihiro Mizuno ,  Hisao Okuda ,  Hiromitsu Soneda ,  Tsuyoshi Matsumoto ,  Osamu Tsuboi ,  Ippei Sawaki

    发明人： Norinao Kouma ,  Yoshihiro Mizuno ,  Hisao Okuda ,  Hiromitsu Soneda ,  Tsuyoshi Matsumoto ,  Osamu Tsuboi ,  Ippei Sawaki

    IPC分类号： B32B3/06 ,  G02B7/182 ,  H01L23/58 ,  G01P3/44 ,  G01P15/097

    CPC分类号： B81C1/00682 ,  B81B2203/0136 ,  Y10T428/24025 ,  Y10T428/2457 ,  Y10T428/24612

    摘要： A microstructure device is made by processing a material substrate consisting of e.g. a first process layer, a second process layer and a middle layer arranged between the first and the second process layers. The microstructure device includes a first structural part and a second structural part that has a portion facing the first structural part via a gap. The first and the second structural parts are connected to each other by a connecting part extending across the gap. This connecting part is formed in the first process layer to be in contact with the middle layer. The microstructure device also includes a protective part extending from the first structural part toward the second structural part or vice versa. The protective part is formed in the first or second process layer to be in contact with the middle layer.

    摘要翻译： 微结构装置是通过加工由例如玻璃， 布置在第一和第二处理层之间的第一处理层，第二处理层和中间层。 微结构装置包括第一结构部分和第二结构部分，其具有经由间隙面对第一结构部分的部分。 第一和第二结构部件通过跨越间隙延伸的连接部分相互连接。 该连接部形成在第一处理层中以与中间层接触。 微结构装置还包括从第一结构部件朝向第二结构部件延伸的保护部件，反之亦然。 保护部分形成在第一或第二处理层中以与中间层接触。

    MICRO OSCILLATING DEVICE
    3.
    发明申请
    MICRO OSCILLATING DEVICE 失效
    微型振荡器件

    公开(公告)号：US20100007940A1

    公开(公告)日：2010-01-14

    申请号：US12484456

    申请日：2009-06-15

    申请人： Osamu Tsuboi ,  Norinao Kouma ,  Yoshihiro Mizuno ,  Hiromitsu Soneda ,  Hisao Okuda ,  Tsuyoshi Matsumoto

    发明人： Osamu Tsuboi ,  Norinao Kouma ,  Yoshihiro Mizuno ,  Hiromitsu Soneda ,  Hisao Okuda ,  Tsuyoshi Matsumoto

    IPC分类号： G02B26/08

    CPC分类号： G02B26/0841

    摘要： A micro oscillating device includes a first frame; an oscillating portion; a first twist coupling portion and a second twist coupling portion coupling the first frame and the oscillating portion to define a first shaft center of an oscillating operation of the oscillating portion; a second frame including a support base and an arm portion extended from the support base toward the oscillating portion; and a third twist coupling portion and a fourth twist coupling portion coupling the second frame and the first frame to define a second shaft center of an oscillating operation of the first frame, wherein the third twist coupling portion is coupled to the first frame and the arm portion between the oscillating portion and the support base, and the fourth twist coupling portion is coupled to the first frame and the support base or the arm portion between the oscillating portion and the support base.

    摘要翻译： 微振荡装置包括：第一框架; 振荡部分; 第一扭转联接部分和第二扭转联接部分，其联接所述第一框架和所述振荡部分，以限定所述振荡部分的振荡操作的第一轴心; 第二框架，包括支撑基座和从支撑基部向振荡部分延伸的臂部分; 以及第三扭转联接部分和第四扭转联接部分，其联接所述第二框架和所述第一框架以限定所述第一框架的振荡操作的第二轴心，其中所述第三扭转联接部分联接到所述第一框架和所述臂 所述摆动部分与所述支撑基座之间的部分，所述第四扭转联接部分在所述振荡部分和所述支撑基座之间联接到所述第一框架和所述支撑基座或所述臂部分。

    MICRO ROCKING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    4.
    发明申请
    MICRO ROCKING DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    微型摇动装置及其制造方法

    公开(公告)号：US20090267445A1

    公开(公告)日：2009-10-29

    申请号：US12249677

    申请日：2008-10-10

    申请人： Yoshihiro MIZUNO ,  Norinao Kouma ,  Hisao Okuda ,  Hiromitsu Soneda ,  Tsuyoshi Matsumoto ,  Osamu Tsuboi ,  Ippei Sawaki

    发明人： Yoshihiro MIZUNO ,  Norinao Kouma ,  Hisao Okuda ,  Hiromitsu Soneda ,  Tsuyoshi Matsumoto ,  Osamu Tsuboi ,  Ippei Sawaki

    IPC分类号： H02N11/00 ,  B44C1/22

    CPC分类号： G02B26/0841 ,  B81B3/0005 ,  B81C1/0096 ,  H02N1/008

    摘要： A micro rocking device includes a frame, a rocking portion, a torsion connecting portion, and a second comb-like electrode, the rocking portion including a first comb-like electrode. The torsion connecting portion connects the frame and the rocking portion. The torsion connecting portion defines the axis of rotational displacement of the rocking portion. The second comb-like electrode attracts the first comb-like electrode and rotationally displaces the rocking portion. The first comb-like electrode has a plurality of first parallel electrode teeth which extend in the direction of the axis and which are spaced from each other in a direction crossing the extension direction. The second comb-like electrode has a plurality of second parallel electrode teeth which extend in the direction of the axis and which are spaced from each other in a direction crossing the extension direction.

    摘要翻译： 微型摆动装置包括框架，摇摆部分，扭转连接部分和第二梳状电极，摇摆部分包括第一梳状电极。 扭转连接部分连接框架和摆动部分。 扭转连接部分限定摆动部分的旋转位移的轴线。 第二梳状电极吸引第一梳状电极并使摆动部分旋转移位。 第一梳状电极具有多个第一平行电极齿，该第一平行电极齿在轴线方向上延伸并且在与延伸方向交叉的方向上彼此间隔开。 第二梳状电极具有多个第二平行电极齿，该第二平行电极齿在轴线方向上延伸并且在与延伸方向交叉的方向上彼此间隔开。

    Micro oscillating device
    5.
    发明授权
    Micro oscillating device 失效
    微振荡器

    公开(公告)号：US07903315B2

    公开(公告)日：2011-03-08

    申请号：US12484456

    申请日：2009-06-15

    申请人： Osamu Tsuboi ,  Norinao Kouma ,  Yoshihiro Mizuno ,  Hiromitsu Soneda ,  Hisao Okuda ,  Tsuyoshi Matsumoto

    发明人： Osamu Tsuboi ,  Norinao Kouma ,  Yoshihiro Mizuno ,  Hiromitsu Soneda ,  Hisao Okuda ,  Tsuyoshi Matsumoto

    IPC分类号： G02B26/00

    CPC分类号： G02B26/0841

    摘要： A micro oscillating device includes a first frame; an oscillating portion; a first twist coupling portion and a second twist coupling portion coupling the first frame and the oscillating portion to define a first shaft center of an oscillating operation of the oscillating portion; a second frame including a support base and an arm portion extended from the support base toward the oscillating portion; and a third twist coupling portion and a fourth twist coupling portion coupling the second frame and the first frame to define a second shaft center of an oscillating operation of the first frame, wherein the third twist coupling portion is coupled to the first frame and the arm portion between the oscillating portion and the support base, and the fourth twist coupling portion is coupled to the first frame and the support base or the arm portion between the oscillating portion and the support base.

    摘要翻译： 微振荡装置包括：第一框架; 振荡部分; 第一扭转联接部分和第二扭转联接部分，其联接所述第一框架和所述振荡部分，以限定所述振荡部分的振荡操作的第一轴心; 第二框架，包括支撑基座和从支撑基部向振荡部分延伸的臂部分; 以及第三扭转联接部分和第四扭转联接部分，其联接所述第二框架和所述第一框架以限定所述第一框架的振荡操作的第二轴心，其中所述第三扭转联接部分联接到所述第一框架和所述臂 所述摆动部分与所述支撑基座之间的部分，所述第四扭转联接部分在所述振荡部分和所述支撑基座之间联接到所述第一框架和所述支撑基座或所述臂部分。

    Method of making microstructure device, and microstructure device made by the same
    6.
    发明申请
    Method of making microstructure device, and microstructure device made by the same 有权
    制造微结构器件的方法及其制造的微结构器件

    公开(公告)号：US20080075924A1

    公开(公告)日：2008-03-27

    申请号：US11902011

    申请日：2007-09-18

    申请人： Norinao Kouma ,  Yoshihiro Mizuno ,  Hisao Okuda ,  Hiromitsu Soneda ,  Tsuyoshi Matsumoto ,  Osamu Tsuboi ,  Ippei Sawaki

    发明人： Norinao Kouma ,  Yoshihiro Mizuno ,  Hisao Okuda ,  Hiromitsu Soneda ,  Tsuyoshi Matsumoto ,  Osamu Tsuboi ,  Ippei Sawaki

    IPC分类号： B32B3/30 ,  H01B13/00

    CPC分类号： B81C1/00682 ,  B81B2203/0136 ,  Y10T428/24025 ,  Y10T428/2457 ,  Y10T428/24612

    摘要： A microstructure device is made by processing a material substrate consisting of e.g. a first process layer, a second process layer and a middle layer arranged between the first and the second process layers. The microstructure device includes a first structural part and a second structural part that has a portion facing the first structural part via a gap. The first and the second structural parts are connected to each other by a connecting part extending across the gap. This connecting part is formed in the first process layer to be in contact with the middle layer. The microstructure device also includes a protective part extending from the first structural part toward the second structural part or vice versa. The protective part is formed in the first or second process layer to be in contact with the middle layer.

    摘要翻译： 微结构装置是通过加工由例如玻璃， 布置在第一和第二处理层之间的第一处理层，第二处理层和中间层。 微结构装置包括第一结构部分和第二结构部分，其具有经由间隙面对第一结构部分的部分。 第一和第二结构部件通过跨越间隙延伸的连接部分相互连接。 该连接部形成在第一处理层中以与中间层接触。 微结构装置还包括从第一结构部件朝向第二结构部件延伸的保护部件，反之亦然。 保护部分形成在第一或第二处理层中以与中间层接触。

    Microstructure and microstructure manufacture method
    7.
    发明授权
    Microstructure and microstructure manufacture method 有权
    微结构和微结构制造方法

    公开(公告)号：US08471152B2

    公开(公告)日：2013-06-25

    申请号：US13091728

    申请日：2011-04-21

    申请人： Yoshihiro Mizuno ,  Norinao Kouma ,  Hisao Okuda ,  Hiromitsu Soneda ,  Tsuyoshi Matsumoto ,  Osamu Tsuboi

    发明人： Yoshihiro Mizuno ,  Norinao Kouma ,  Hisao Okuda ,  Hiromitsu Soneda ,  Tsuyoshi Matsumoto ,  Osamu Tsuboi

    IPC分类号： H05K1/03

    CPC分类号： B81C1/00698 ,  Y10T29/49117

    摘要： A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face.

    摘要翻译： 微结构包括具有第一导体，第二导​​体和位于第一和第二导体之间的中间绝缘体的层压结构。 第一导体包括相对于第二导体的相对面，侧面和形成上述相对面和侧面的边界的边缘部分。 第二导体包括延伸超过超过第一导体的边缘部分的延伸面。 绝缘膜包括覆盖边缘部分的至少一部分和/或侧面的至少一部分的区域。