公开(公告)号：US20250096079A1

公开(公告)日：2025-03-20

申请号：US18729353

申请日：2022-12-27

Applicant: Hitachi Astemo, Ltd.

Inventor： Masahiro SEO ,  Takeshi TOKUYAMA ,  Takashi ISHII

IPC: H01L23/495 ,  H01L25/07 ,  H02M7/00

Abstract: In this semiconductor device and the inverter provided with the semiconductor device, an upper arm semiconductor element on a positive electrode wiring plate and an AC wiring plate are connected to each other by a first wiring member, and a lower arm semiconductor element on the AC wiring plate and a negative electrode wiring plate are connected to each other by a second wiring member. The AC wiring plate has: a first region to which the first wiring member is to be connected; a second region in which the lower arm semiconductor element is to be provided; and a connection region that connects these two regions. The connection region is positioned opposite positive-electrode/negative-electrode terminals with a region in between where the first and second wiring members are used, and the placement order is as follows: the positive electrode wiring plate, the negative electrode wiring plate, the first region, and the second region.