公开(公告)号：US20220312648A1

公开(公告)日：2022-09-29

申请号：US17703685

申请日：2022-03-24

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Bo XU ,  Hao MENG

IPC: H05K7/20

Abstract: A chassis and a power supply system include a body and a heat dissipation component configured to dissipate heat for heat generation modules in the body. The heat dissipation component includes a spacer board and at least one fan disposed on the spacer board. An annular air duct includes a first air duct surrounded by the spacer board and a second air duct located between the spacer board and sidewalls of the body, and the first air duct communicates with the second air duct. The annular air duct is formed in the body by using the spacer board, so that air flow can be implemented with a small quantity of fans, and temperatures of the air in the body are balanced, thereby improving a heat dissipation effect, reducing a quantity of fans, reducing space occupied by the fans, and increasing space for placing components in the body.