公开(公告)号：US12170868B2

公开(公告)日：2024-12-17

申请号：US17773710

申请日：2020-10-14

Applicant: Huawei Technologies Co., Ltd.

Inventor： Deliang Li ,  Shaojian Chen ,  Xueping Guo ,  Dongyi Zhu ,  Fuqiang Ma ,  Hongbing Shi ,  Runqing Ye

IPC: H04R1/10

Abstract: The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion that are connected to the rigid board portion. The rigid board portion is located in the earbud portion. The first flexible board portion is located in the earbud portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end thereof extends to the ear handle portion. A plurality of layers of components are stacked on the rigid board portion of the wireless headset, so that component integration degree is high.

公开(公告)号：US20220386015A1

公开(公告)日：2022-12-01

申请号：US17773710

申请日：2020-10-14

Applicant: Huawei Technologies Co., Ltd.

Inventor： Deliang Li ,  Shaojian Chen ,  Xueping Guo ,  Dongyi Zhu ,  Fuqiang Ma ,  Hongbing Shi ,  Runqing Ye

IPC: H04R1/10

Abstract: The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion that are connected to the rigid board portion. The rigid board portion is located in the earbud portion. The first flexible board portion is located in the earbud portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end thereof extends to the ear handle portion. A plurality of layers of components are stacked on the rigid board portion of the wireless headset, so that component integration degree is high.