公开(公告)号：US20170277932A1

公开(公告)日：2017-09-28

申请号：US15512278

申请日：2014-09-18

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xu Peng ,  Jianglin Gu ,  Bo Huang

IPC: G06K9/00 ,  H04L9/32 ,  G06F21/32

CPC classification number: G06K9/0002 ,  G06F21/32 ,  G06K9/00 ,  G06K9/00006 ,  G06K9/00087 ,  H04L9/3231

Abstract: Embodiments of the present invention provide a fingerprint recognition apparatus. The finger recognition apparatus includes a conductive housing. Additionally, the finger recognition apparatus includes a conductor frame, configured to transmit a radio frequency signal. The fingerprint recognition apparatus also includes an insulation layer, disposed between the conductor frame and the conductive housing.

公开(公告)号：US10296774B2

公开(公告)日：2019-05-21

申请号：US15512278

申请日：2014-09-18

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xu Peng ,  Jianglin Gu ,  Bo Huang

IPC: G06K9/00 ,  G06F21/32 ,  H04L9/32

Abstract: Embodiments of the present invention provide a fingerprint recognition apparatus. The finger recognition apparatus includes a conductive housing. Additionally, the finger recognition apparatus includes a conductor frame, configured to transmit a radio frequency signal. The fingerprint recognition apparatus also includes an insulation layer, disposed between the conductor frame and the conductive housing.