公开(公告)号：US20230403802A1

公开(公告)日：2023-12-14

申请号：US18457723

申请日：2023-08-29

Applicant: Huawei Technologies Co., Ltd.

Inventor： Wenqian Hu ,  Han Su ,  Jian Li

IPC: H05K5/00 ,  H04M1/02 ,  H05K5/02 ,  G06F1/16

CPC classification number: H05K5/0021 ,  H04M1/0254 ,  H05K5/0256 ,  G06F1/1624 ,  G06F1/1658

Abstract: The present technology discloses a frameless modular multi-functional electronic device. The electronic device includes a base module with a processor and multiple component modules, at least one of which is configured to connect directly in contact with the base module. The modules each include a connecting member to slidably align and mate the component modules together, and an electrical interface to transmit digital information and energy between connected base and component modules. The component modules are interchangeably connected directly in contact with each other and, when assembled, form the frameless modular multi-functional electronic device.