公开(公告)号：US12041710B2

公开(公告)日：2024-07-16

申请号：US17451995

申请日：2021-10-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zhen Sun ,  Zhen Lu ,  Yuping Hong

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K7/20336

Abstract: A heat dissipation apparatus is provided. The heat dissipation apparatus includes a thermally conductive housing. The heat dissipation apparatus is connectable to a chip so that the chip is arrangeable on a chip placement region of the thermally conductive housing. A capillary structure is disposed on the thermally conductive housing and a working medium is placed in the capillary structure. The capillary structure includes a first capillary structure and a second capillary structure that are connected, and a maximum thickness of the first capillary structure is less than a minimum thickness of the second capillary structure.

公开(公告)号：US11864350B2

公开(公告)日：2024-01-02

申请号：US17631256

申请日：2020-07-23

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yongfu Sun ,  Jian Shi ,  Jie Yang ,  Linfang Jin ,  Zhen Sun

IPC: H05K7/20 ,  H05K5/00

CPC classification number: H05K7/20336 ,  H05K5/0017 ,  H05K7/2099

Abstract: A heat conduction apparatus includes a first cover plate and a second cover plate. The first cover plate is hermetically connected to the second cover plate. The first cover plate is provided with a plurality of grooves. A supporting portion is formed between two adjacent grooves. A liquid circulation channel and a vapor circulation channel are formed in the groove. The liquid circulation channel is filled with a liquid working medium. The liquid circulation channel is communicated with the vapor circulation channel. The liquid working medium vaporizes into vapor. The vapor enters the vapor circulation channel and condenses into liquid. The liquid enters the liquid circulation channel.

公开(公告)号：US20220279683A1

公开(公告)日：2022-09-01

申请号：US17631256

申请日：2020-07-23

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yongfu Sun ,  Jian Shi ,  Jie Yang ,  Linfang Jin ,  Zhen Sun

IPC: H05K7/20 ,  H05K5/00

Abstract: A heat conduction apparatus includes a first cover plate and a second cover plate. The first cover plate is hermetically connected to the second cover plate. The first cover plate is provided with a plurality of grooves. A supporting portion is formed between two adjacent grooves. A liquid circulation channel and a vapor circulation channel are formed in the groove. The liquid circulation channel is filled with a liquid working medium. The liquid circulation channel is communicated with the vapor circulation channel. The liquid working medium vaporizes into vapor. The vapor enters the vapor circulation channel and condenses into liquid. The liquid enters the liquid circulation channel.