公开(公告)号：US09736276B2

公开(公告)日：2017-08-15

申请号：US14310164

申请日：2014-06-20

Applicant: INTEL CORPORATION

Inventor： Mahesh Wagh ,  Abhishek Singhal ,  Jasmin Ajanovic

IPC: H04L29/06 ,  G06F13/38

CPC classification number: H04L69/22 ,  G06F13/385 ,  Y02D10/14 ,  Y02D10/151

Abstract: In one embodiment, the present invention includes a fabric on a first semiconductor die to communicate with at least one agent on the die according to an on-chip protocol and a packetization layer coupled to the fabric to receive command and data information from the fabric on multiple links and to packetize the information into a packet for transmission from the die to another die via an in-package packetized link. Other embodiments are described and claimed.