公开(公告)号：US20230244280A1

公开(公告)日：2023-08-03

申请号：US17587976

申请日：2022-01-28

Applicant: INTEL CORPORATION

Inventor： Denica N. Larsen ,  Ming-Chia Lee ,  Naoki Matsumura ,  Prosenjit Ghosh ,  Jordan E. Maslov ,  Peiwang Chen

IPC: G06F1/16

CPC classification number: G06F1/1681 ,  G06F1/1683

Abstract: Various embodiments relate to an electronic device with a first panel and a second panel coupled by a hinge mechanism. The electronic device may include a first wire that communicatively couples components of the first panel with components of the second panel. The wire may pass through the hinge mechanism, and be tensioned by a tensioning mechanism that provides tension to the first wire when the electronic device is in an open position and a closed position. Other embodiments may be described and/or claimed.