公开(公告)号：US09847509B2

公开(公告)日：2017-12-19

申请号：US15003803

申请日：2016-01-22

Applicant: Industrial Technology Research Institute

Inventor： Kun-Ming Chen ,  Chen-Chu Tsai ,  Yuh-Zheng Lee ,  Kuo-Lung Lo

IPC: H01L51/52

CPC classification number: H01L51/5256 ,  H01L51/5246 ,  H01L2251/5338 ,  H01L2251/558

Abstract: A flexible environmental sensitive electronic device package including a flexible electronic device, a thin film encapsulation (TFE) and a sealing member is provided. The TFE covers the flexible electronic device as well as the sealing member covers the TFE and the flexible electronic device. The sealing member includes a first portion and a second portion, wherein the first portion covers the flexible electronic device and the TFE, and the second portion covers the first portion. Young's modulus of the second portion is between the 0 MPa and 100 MPa. Young's modulus of the first portion is greater than that of the second portion. The thickness of the first portion is less than that of the second portion.

公开(公告)号：US20160218320A1

公开(公告)日：2016-07-28

申请号：US15003803

申请日：2016-01-22

Applicant: Industrial Technology Research Institute

Inventor： Kun-Ming Chen ,  Chen-Chu Tsai ,  Yuh-Zheng Lee ,  Kuo-Lung Lo

IPC: H01L51/52

CPC classification number: H01L51/5256 ,  H01L51/5246 ,  H01L2251/5338 ,  H01L2251/558

Abstract: A flexible environmental sensitive electronic device package including a flexible electronic device, a thin film encapsulation (TFE) and a sealing member is provided. The TFE covers the flexible electronic device as well as the sealing member covers the TFE and the flexible electronic device. The sealing member includes a first portion and a second portion, wherein the first portion covers the flexible electronic device and the TFE, and the second portion covers the first portion. Young's modulus of the second portion is between the 0 MPa and 100 MPa. Young's modulus of the first portion is greater than that of the second portion. The thickness of the first portion is less than that of the second portion.

Abstract translation: 提供一种灵活的环境敏感的电子器件封装，包括柔性电子器件，薄膜封装（TFE）和密封构件。 TFE覆盖柔性电子设备，密封构件覆盖TFE和柔性电子设备。 密封构件包括第一部分和第二部分，其中第一部分覆盖柔性电子装置和TFE，并且第二部分覆盖第一部分。 第二部分的杨氏模量在0MPa和100MPa之间。 第一部分的杨氏模量大于第二部分的杨氏模量。 第一部分的厚度小于第二部分的厚度。