公开(公告)号：US20230416362A1

公开(公告)日：2023-12-28

申请号：US18318776

申请日：2023-05-17

Applicant: Industrial Technology Research Institute

Inventor： Min-Yuan CHOU ,  Li-Tsen LIN ,  Chung-Yuan SUN ,  Ya-Ping LAI ,  Chin-Pen LAI ,  Ssu-Yuan WU ,  Mei-Wei LIN

IPC: C07K16/28 ,  A61P35/00

CPC classification number: C07K16/2803 ,  A61P35/00 ,  A61K45/06

Abstract: Antibodies and antigen-binding fragments that bind to TIGIT are disclosed. The disclosure further relates to methods and compositions for use in treating an immune-related disease (e.g., a cancer or an infection or infectious disease) by administering a composition disclosed herein.

公开(公告)号：US20210087266A1

公开(公告)日：2021-03-25

申请号：US16948563

申请日：2020-09-23

Applicant: Industrial Technology Research Institute

Inventor： Min-Yuan CHOU ,  Li-Tsen LIN ,  Chung-Yuan SUN ,  Ya-Ping LAI ,  Chin-Pen LAI ,  Ssu-Yuan WU ,  Mei-Wei LIN

IPC: C07K16/28 ,  A61P35/00

Abstract: Antibodies and antigen-binding fragments that bind to TIGIT are disclosed. The disclosure further relates to methods and compositions for use in treating an immune-related disease (e.g., a cancer or an infection or infectious disease) by administering a composition disclosed herein.