公开(公告)号：US20230041154A1

公开(公告)日：2023-02-09

申请号：US17880020

申请日：2022-08-03

Applicant: Infineon Technologies AG

Inventor： Wolfgang SCHWEIKER ,  Simone FONTANESI ,  Simon HAINZ ,  Manfred SCHINDLER ,  Michael WEBER

IPC: G01P3/481

Abstract: A wheel sensor arrangement can include a first wheel speed sensor and a second wheel speed sensor. The first wheel speed sensor can include or be implemented with a first semiconductor die and can provide data regarding a speed of a rotating wheel. The second wheel speed sensor can also include or be implemented with a second semiconductor die and can provide data regarding the speed of the rotating wheel. The second semiconductor die can be galvanically isolated from the first semiconductor die. The wheel sensor arrangement can include a mold housing that forms around the first wheel speed sensor and the second wheel speed sensor. The mold housing can include a separation feature between the first sensor and the second sensor.

公开(公告)号：US20200341023A1

公开(公告)日：2020-10-29

申请号：US16841870

申请日：2020-04-07

Applicant: Infineon Technologies AG

Inventor： Manfred SCHINDLER ,  Horst THEUSS ,  Michael WEBER

IPC: G01P3/44 ,  H01L25/16 ,  H01L23/62 ,  H01L49/02 ,  H01L23/31 ,  G01D5/14 ,  G01D5/16

Abstract: A magnetic field sensor package comprises a chip carrier, a magnetic field sensor which is arranged on the chip carrier and designed to detect a magnetic field, an integrated circuit which is arranged on the chip carrier and designed to logically process sensor signals provided by the magnetic field sensor, and at least one integrated passive component which is electrically coupled to at least one of the magnetic field sensor or the integrated circuit.