公开(公告)号：US20240105739A1

公开(公告)日：2024-03-28

申请号：US18450593

申请日：2023-08-16

Applicant: InnoLux Corporation

Inventor： Wen-Bin HUNG ,  Cheng-Wei LEE

IPC: H01L27/12

CPC classification number: H01L27/1248 ,  H01L27/1244

Abstract: An electronic device includes a substrate, a conductive structure disposed on the substrate, and a first insulating island disposed on the conductive structure. The conductive structure includes a first conductive component, a second conductive component, and a third conductive component. The third conductive component is disposed on the first conductive component and the second conductive component. The third conductive component is electrically connected to the first conductive component and the second conductive component. In a cross-sectional view of the electronic device, the width of the first insulating island is greater than the width of the third conductive component.