公开(公告)号：US20250110408A1

公开(公告)日：2025-04-03

申请号：US18375031

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Robert JORDAN ,  Brandon HOLYBEE ,  James BLACKWELL ,  Blake BLUESTEIN ,  Eric MATTSON ,  Marie KRYSAK ,  Nicole GUZMAN ,  Shane HARLSON ,  Eungnak HAN ,  Florian GSTREIN

IPC: G03F7/11 ,  G03F7/20 ,  G03F7/38

Abstract: Provided are methods and compounds for using an adhesively switchable underlayer beneath a photoresist in a lithographic process for making a semiconductor wafer.