公开(公告)号：US20250005208A1

公开(公告)日：2025-01-02

申请号：US18217547

申请日：2023-07-01

Applicant: Intel Corporation

Inventor： Dumitru-Daniel DINU ,  Santosh GHOSH ,  Avinash VARNA ,  Manoj SASTRY

IPC: G06F21/75

Abstract: Techniques for improved Keccak execution resilient to physical side-channel attacks are described. In some examples, a Keccak round datapath includes a first path including a theta step, a rho step, a pi step, and an iota step to process a masked version of the 1600-bit input state, a second path including a theta step, a rho step, and a pi step to process a mask 1600-bit input state, and a masked chi step shared by the first path and second path.