公开(公告)号：US20220415770A1

公开(公告)日：2022-12-29

申请号：US17356046

申请日：2021-06-23

Applicant: Intel Corporation

Inventor： Omkar KARHADE ,  Sai VADLAMANI ,  Xavier F. BRUN ,  Hemanth DHAVALESWARAPU

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/528 ,  H01L21/50 ,  H01L33/62 ,  H01L31/02

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to multilevel dies, in particular to photonics integrated circuit dies with a thick portion and a thin portion, where the thick portion is placed within a cavity in a substrate and the thin portion serves as an overhang to physically couple with the substrate, to reduce a distance between electrical contacts on the thin portion of the die and electrical contacts on the substrate. Other embodiments may be described and/or claimed.