公开(公告)号：US20250112125A1

公开(公告)日：2025-04-03

申请号：US18478222

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Ranjul Balakrishnan ,  Prabhat Ranjan ,  Prashant Dhirubhai Parmar ,  Naren Sreenivas Viswanathan ,  Russell Kevin Mortensen

IPC: H01L23/482 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065

Abstract: Bridges over metal voids in integrated circuit packages are disclosed. An example a substrate for an electronic circuit comprising a first conductive layer having an aperture extending through the first conductive layer, the aperture aligned with a contact pad, the first conductive layer including an arm extending from a first location on a perimeter of the aperture to a second location on the perimeter of the aperture, and a second conductive layer adjacent to the first conductive layer, the second conductive layer including a metal trace positioned adjacent to the arm, the arm between the metal trace and the contact pad.