公开(公告)号：US20250022527A1

公开(公告)日：2025-01-16

申请号：US18902009

申请日：2024-09-30

Applicant: Intel Corporation

Inventor： Santhosh Kumar Chandrakanthan

IPC: G11C29/12 ,  G11C29/36

Abstract: An example integrated circuit disclosed herein includes a first die including first microbumps associated with a source-synchronous data interface of a three-dimensional (3D) die stack, a first one of the first microbumps in circuit with a clock output of the first die, a second one of the first microbumps in circuit with a data output of the first die, the clock output and the data output associated with a transmitter side of the source-synchronous data interface. The example integrated circuit also includes a second die including second microbumps associated with the source-synchronous data interface of the 3D die stack, a first one of the second microbumps in circuit with a clock input of the second die, a second one of the second microbumps in circuit with a data input of the second die, the clock input and the data input associated with a receiver side of the source-synchronous data interface.