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1.发明申请公开(公告)号：US20210315097A1
公开(公告)日：2021-10-07
申请号：US17353163
申请日：2021-06-21
Applicant: Intel Corporation
Inventor： Ranjul Balakrishnan , Roman Meltser , Prabhat Ranjan , Shivani R. Jain
IPC: H05K1/02
Abstract: In one embodiment, an apparatus includes a circuit board having a parallel bus with a first trace and a second trace, a first inductive coil coupled to the first trace, and a second inductive coil coupled to the second trace. The first and second inductive coils are arranged to inductively couple with one another to reduce cross talk effects in the parallel bus.
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