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公开(公告)号：US20220015273A1
公开(公告)日：2022-01-13
申请号：US17483415
申请日：2021-09-23
Applicant: Intel Corporation
Inventor： Bala P. Subramanya , Prakash Kurma Raju , Navneet K. Singh , Sachin Bedare , Vijith Halestoph R.
Abstract: An example electronic device is disclosed that includes a printed circuit board, an electronic component coupled to the printed circuit board, and a solderless shield coupled to the printed circuit board and covering the electronic component.
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