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公开(公告)号:US06841022B2
公开(公告)日:2005-01-11
申请号:US10260342
申请日:2002-10-01
IPC分类号: H01L25/18 , H01L21/52 , H01L21/60 , H01L21/603 , H01L21/68 , H01L25/04 , H05K3/32 , B32B31/18 , B05D5/12 , B32B31/20 , H01L21/50 , H01L21/58
CPC分类号: H05K3/323 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/743 , H01L2224/7511 , H01L2224/83191 , H01L2224/83209 , H01L2224/838 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01021 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H05K2201/10674 , H05K2201/10984 , H05K2203/0338 , Y10S428/914 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T156/1054 , Y10T156/1066 , Y10T156/108 , Y10T428/2486 , Y10T428/287 , H01L2924/00
摘要: An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer. The cohesive strength of the adhesive film layer decreases when the adhesive film layer is heated to a predetermined temperature. Electronic parts each have an electrode surface and at least one electrode on the electrode surface. The electrode surface of each of the electronic parts is affixed to the adhesive film layer such that the adhesive film layer coats all exposed portions of the electrode surface and coats all exposed surfaces of the at least one electrode.
摘要翻译: 一种装置包括具有隔离层和形成在隔离层上的粘合膜层的连接片,使得所述粘合剂膜层可以从隔离层剥离。 当粘合剂膜层被加热到预定温度时,粘合膜层的内聚强度降低。 电子部件各自具有电极表面和电极表面上的至少一个电极。 每个电子部件的电极表面固定到粘合膜层,使得粘合剂膜层涂覆电极表面的所有暴露部分并涂覆至少一个电极的所有暴露表面。
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2.
公开(公告)号:US06479757B1
公开(公告)日:2002-11-12
申请号:US09685951
申请日:2000-10-12
IPC分类号: H05K102
CPC分类号: H05K3/323 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/743 , H01L2224/7511 , H01L2224/83191 , H01L2224/83209 , H01L2224/838 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01021 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H05K2201/10674 , H05K2201/10984 , H05K2203/0338 , Y10S428/914 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T156/1054 , Y10T156/1066 , Y10T156/108 , Y10T428/2486 , Y10T428/287 , H01L2924/00
摘要: An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer. The cohesive strength of the adhesive film layer decreases when the adhesive film layer is heated to a predetermined temperature. Electronic parts each have an electrode surface and at least one electrode on the electrode surface. The electrode surface of each of the electronic parts is affixed to the adhesive film layer such that the adhesive film layer coats all exposed portions of the electrode surface and coats all exposed surfaces of the at least one electrode
摘要翻译: 一种装置包括具有隔离层和形成在隔离层上的粘合膜层的连接片,使得所述粘合剂膜层可以从隔离层剥离。 当粘合剂膜层被加热到预定温度时,粘合膜层的内聚强度降低。 电子部件各自具有电极表面和电极表面上的至少一个电极。 每个电子部件的电极表面固定到粘合剂膜层,使得粘合剂膜层涂覆电极表面的所有暴露部分并且涂覆至少一个电极的所有暴露表面
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3.
公开(公告)号:US6158115A
公开(公告)日:2000-12-12
申请号:US907017
申请日:1997-08-06
IPC分类号: H01L25/18 , H01L21/52 , H01L21/60 , H01L21/603 , H01L21/68 , H01L25/04 , H05K3/32 , H05K3/30
CPC分类号: H05K3/323 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/743 , H01L2224/7511 , H01L2224/83191 , H01L2224/83209 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01021 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H05K2201/10674 , H05K2201/10984 , H05K2203/0338 , Y10S428/914 , Y10T156/1054 , Y10T156/1066 , Y10T156/108 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T428/2486 , Y10T428/287
摘要: A method of mounting electronic parts on a circuit board comprises an adhesive layer formation step of forming, on an electrode surface of each electronic part on which electrodes are formed, a film-like thermosetting adhesive layer having an area substantially equal to that of the corresponding electrode surface so as to obtain adhesive-coated electronic parts. The electrodes on which the adhesive layer is formed are arranged so as to face corresponding electrodes of the circuit board, and the electrodes are positioned relative to each other. Heat and pressure are applied to the electrodes of the electronic parts and the electrodes of the circuit board to fix the electrodes to each other after the electrodes are positioned. Almost no adhesive superfluously comes out of the electrode surfaces. Accordingly, when mounting the electronic parts on the circuit board, it is unnecessary to remove superfluous adhesive, unlike conventional process, whereby the efficiency is improved and also the cost can be cut down.
摘要翻译: 一种将电子部件安装在电路板上的方法包括:粘附层形成步骤,在其上形成有电极的每个电子部件的电极表面上形成具有基本上等于相应的面积的膜状热固性粘合剂层 电极表面,以获得粘合剂涂覆的电子部件。 其上形成有粘合剂层的电极被布置成面对电路板的相应电极,并且电极相对于彼此定位。 在电极定位后,将电压和电压施加到电子部件的电极和电路板的电极上以将电极彼此固定。 几乎没有粘合剂从电极表面多余地出来。 因此,当将电子部件安装在电路板上时,与常规方法不同,不需要去除多余的粘合剂,从而提高效率并且还可以降低成本。
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