公开(公告)号：US07600551B2

公开(公告)日：2009-10-13

申请号：US11651740

申请日：2007-01-09

Applicant: Jacques Lussier

Inventor： Jacques Lussier

IPC: E05D15/20

CPC classification number: E05D15/24 ,  E05D15/20 ,  E05F15/668 ,  E05Y2201/638 ,  E05Y2900/106

Abstract: An improved mechanism for the operation of multiple panels door with increased insulating properties comprises a means that keeps the door panels away from the seal as they move up or down vertically and that brings the panels tightly against the seal when the panels have completed their vertical course. In the prior art, a multiple panel door follows the path of the guide rail where in this instant invention, when the panels have run their course along the path of the guide rails, they are moved away from the guide rails and against the door frame, which results in the door panels to apply pressure against an insulating strip.

Abstract translation: 用于具有增加的绝缘性能的多面板门的操作的改进机构包括当门板垂直上下移动时使门板远离密封的装置，并且当面板已经完成其垂直过程时将面板紧紧地紧贴密封件 。 在现有技术中，多面板门跟随导轨的路径，在本发明中，当面板沿着导轨的路径行进时，它们被移动远离导轨并抵靠门框 ，这导致门板对绝缘带施加压力。

公开(公告)号：US20080163552A1

公开(公告)日：2008-07-10

申请号：US11651740

申请日：2007-01-09

Applicant: Jacques Lussier

Inventor： Jacques Lussier

IPC: E05F15/00

CPC classification number: E05D15/24 ,  E05D15/20 ,  E05F15/668 ,  E05Y2201/638 ,  E05Y2900/106

Abstract: An improved mechanism for the operation of multiple panels door with increased insulating properties comprises a means that keeps the door panels away from the seal as they move up or down vertically and that brings the panels tightly against the seal when the panels have completed their vertical course. In the prior art, a multiple panel door follows the path of the guide rail where in this instant invention, when the panels have run their course along the path of the guide rails, they are moved away from the guide rails and against the door frame, which results in the door panels to apply pressure against an insulating strip.

Abstract translation: 用于具有增加的绝缘性能的多面板门的操作的改进机构包括当门板垂直上下移动时使门板远离密封的装置，并且当面板已经完成其垂直过程时将面板紧紧地紧贴密封件 。 在现有技术中，多面板门跟随导轨的路径，在本发明中，当面板沿着导轨的路径行进时，它们被移动远离导轨并抵靠门框 ，这导致门板对绝缘带施加压力。