公开(公告)号：US20080261495A1

公开(公告)日：2008-10-23

申请号：US12148659

申请日：2008-04-21

申请人： Jung-Min Kuo ,  Hung-Sheng Cho ,  Kun-Hsing Hsiao

发明人： Jung-Min Kuo ,  Hung-Sheng Cho ,  Kun-Hsing Hsiao

IPC分类号： B24C3/00

CPC分类号： G02F1/133711 ,  C03C17/002 ,  C03C2218/112 ,  G02F1/1303

摘要： An exemplary alignment apparatus (20) includes a supporting member (24), a conveyor (25), and a high-pressure fluid generator (21). The supporting member is configured for supporting a substrate (23) having an alignment layer (26). The conveyor is configured for conveying the supporting member along a predetermined direction. The high-pressure fluid generator is configured for generating and ejecting high-pressure fluid onto a surface of the alignment layer of the substrate to form an alignment surface. Because the alignment apparatus includes the high-pressure fluid generator which can eject high-pressure fluid to impact the surface of the alignment layer in order to form an alignment surface, no debris is introduced. Therefore, the substrates processed by the alignment apparatus can have improved quality and reliability.

摘要翻译： 示例性对准装置（20）包括支撑构件（24），输送器（25）和高压流体发生器（21）。 支撑构件用于支撑具有取向层（26）的基板（23）。 输送机被构造成沿预定方向输送支撑构件。 高压流体发生器被配置为产生并将高压流体喷射到基板的取向层的表面上以形成对准表面。 由于对准装置包括可以喷射高压流体以冲击对准层的表面以形成对准表面的高压流体发生器，因此不会引入碎屑。 因此，由对准装置处理的基板可以提高质量和可靠性。