公开(公告)号：US12241914B2

公开(公告)日：2025-03-04

申请号：US17910253

申请日：2020-12-28

Applicant: KOA CORPORATION

Inventor： Miyahito Kinoshita

IPC: G01R1/20 ,  G01R19/00 ,  H05K1/11 ,  H05K1/16 ,  H05K3/46

Abstract: A current sensing device including: an insulating resin substrate; a current sensing element arranged in the resin substrate; a current wire provided via an insulating layer with respect to the current sensing element to flow a current through the current sensing element; a plurality of current vias connecting the current sensing element and the current wire through the insulating layer; and a voltage sensing via connected to the current sensing element to measure a voltage drop.

公开(公告)号：US11346862B2

公开(公告)日：2022-05-31

申请号：US17274882

申请日：2019-09-06

Applicant: KOA CORPORATION

Inventor： Takanori Kikuchi ,  Miyahito Kinoshita

IPC: G01R1/20 ,  H05K1/02 ,  H05K1/16 ,  H05K3/46

Abstract: Provided is a current sensing device including: a laminate having a plurality of insulating layers laminated therein; a current sensing element provided in an inner layer of the laminate; a current wire configured to flow current to the current sensing element, the current wire being provided with respect to the current sensing element via an interlayer insulating layer; a plurality of current vias configured to connect the current sensing element and the current wire so as to penetrate through the interlayer insulating layer; and a voltage sensing via configured to obtain a voltage drop in the current sensing element, the voltage sensing via being electrically connected to the current sensing element.