公开(公告)号：US20160163433A1

公开(公告)日：2016-06-09

申请号：US14905459

申请日：2014-07-09

Applicant: KOA CORPORATION

Inventor： Yuya TAKEUE ,  Todaro UEGANE ,  Kentaro MATSUMOTO

IPC: H01C17/28 ,  H01C17/22 ,  H01C17/06

CPC classification number: H01C17/28 ,  H01C17/006 ,  H01C17/06 ,  H01C17/22 ,  H01C17/242

Abstract: The invention is to provide a chip-resistor manufacturing method in which chipping can be restrained from occurring in an intersection portion between each primary segmentation groove and each secondary segmentation groove. Primary segmentation grooves 21 each having an uneven depth are formed in one surface of a large substrate 20. Pairs of surface electrodes 3 extending across the primary segmentation grooves 21, resistive elements 5 each striding between the surface electrodes 3 paired with each other, etc. are formed in the one surface of the large substrate 20. Then, primary segmentation is performed on the large substrate 20 along the primary segmentation grooves 21 so as to open the surface side where the surface electrodes 3, the resistive elements 5, etc. are formed. Thus, a plurality of strip-like substrates 30 are obtained from the large substrate 20. During the primary segmentation, each primary segmentation groove 21 begins to break from electrode formation regions which are small in groove depth but strong, and then breaks in intersection portions which are large in groove depth but brittle. Accordingly, it is possible to perform primary segmentation on the primary segmentation groove 21 without applying a large load to the intersection portions which are low in strength. Thus, it is possible to prevent chipping from occurring in the intersection portions.

Abstract translation: 本发明是提供一种芯片电阻器制造方法，其中可以抑制在每个主分割槽和每个二次分割槽之间的交叉部分发生碎裂。 每个具有不均匀深度的主分割槽21形成在大基板20的一个表面中。一对表面电极3延伸穿过主分割凹槽21，电阻元件5各自跨越彼此配对的表面电极3等。 形成在大基板20的一个表面上。然后，沿着主分割槽21对大基板20进行主分割，以便打开表面电极3，电阻元件5等的表面侧 形成。 因此，从大基板20获得多个条状基板30.在主分割期间，每个主分割凹槽21开始从凹槽深度小但较强的电极形成区域断裂，然后在交叉部分中断 其深度大，但脆。 因此，可以对主分割槽21进行主分割，而不对强度低的交点进行大的负载。 因此，可以防止在交叉部分发生切屑。