公开(公告)号：US20160168718A1

公开(公告)日：2016-06-16

申请号：US14905376

申请日：2014-07-01

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Hongkee LEE ,  Junmi JEON

IPC: C23C18/32

CPC classification number: C23C18/32 ,  C23C18/34 ,  C23C18/36

Abstract: The present invention provides an electroless nickel plating solution supplying high flexibility to a plated layer and having improved stability. The electroless nickel plating solution according to an embodiment of the present invention is an electroless nickel plating layer using an electroless nickel plating method. The electroless nickel plating solution comprises: a nickel metal salt providing a nickel ion for plating, and containing sulfamic acid nickel; a reducer reducing the nickel ion for plating; a complexing agent forming a complex together with the nickel ion for plating; and a cyan-based stabilizer providing stability of the electroless plating solution and preventing the generation of pits in a flexible nickel plated layer.

Abstract translation: 本发明提供了一种向镀层提供高柔性并且具有改进的稳定性的化学镀镍溶液。 根据本发明的一个实施方案的化学镀镍溶液是使用无电镀镍方法的无电镀镍层。 无电镀镍溶液包括：提供用于电镀的镍离子的镍金属盐，并含有氨基磺酸镍; 还原剂减少电镀镍离子; 与镍离子一起形成络合剂以进行电镀; 以及提供化学镀溶液的稳定性并防止在柔性镀镍层中产生凹坑的青色稳定剂。