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1.发明公开公开(公告)号：US20230217587A1
公开(公告)日：2023-07-06
申请号：US17703277
申请日：2022-03-24
Applicant: Korea Institute of Science and Technology
Inventor： Phillip LEE , SeungJun CHUNG , HeeSuk KIM , JeongGon SON , SukJoon HWANG
CPC classification number: H05K1/0283 , H05K3/00 , H05K2201/09063
Abstract: Disclosed is a method of manufacturing a stretchable substrate having improved stretch uniformity according to various embodiments of the present disclosure in order to implement the above-described object. The method may include forming an auxetic including a plurality of unit structures, and attaching one or more elastic sheets to the auxetic and forming a stretchable substrate.
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2.发明公开公开(公告)号：US20230217588A1
公开(公告)日：2023-07-06
申请号：US17703520
申请日：2022-03-24
Applicant: Korea Institute of Science and Technology
Inventor： Phillip LEE , SeungJun CHUNG , HeeSuk KIM , JeongGon SON , SukJoon HWANG
CPC classification number: H05K1/0283 , H05K3/00 , H05K2201/09063
Abstract: Disclosed is a method of manufacturing a stretchable substrate having improved stretch uniformity according to various embodiments of the present disclosure in order to implement the above-described object. The method may include forming an auxetic including a plurality of unit structures, and attaching one or more elastic sheets to the auxetic and forming a stretchable substrate.
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