摘要:
The thermal storage material microcapsules of the present invention are thermal storage material microcapsules encapsulating a thermal storage material, and the thermal storage material comprising at least one selected from compounds of the following formulae (I) to (III), R1-X-R2 (I) wherein each of R1 and R2 is independently a hydrocarbon group having 6 or more carbon atoms and X is a divalent binding group containing a heteroatom, R3(-Y-R4)n (II) wherein R3 is a hydrocarbon group having a valence of n, each of R4s is independently a hydrocarbon group having 6 or more carbon atoms and each Y is a divalent binding group containing a heteroatom, A(-Z-R5)m (III) wherein A is an atom, atomic group or binding group having a valence of m, each of R5s is independently a hydrocarbon group having 6 or more carbon atoms and each Z is a divalent binding group containing a heteroatom or a direct bond, the thermal storage material having an acid value of 8 or less.