Mechanical pencil
    3.
    外观设计

    公开(公告)号:USD1010733S1

    公开(公告)日:2024-01-09

    申请号:US29735216

    申请日:2020-05-19

    摘要: FIG. 1 is a perspective view of a mechanical pencil, showing our new design;
    FIG. 2 is a front view of the mechanical pencil;
    FIG. 3 is a rear view of the mechanical pencil;
    FIG. 4 is a top view of the mechanical pencil;
    FIG. 5 is a bottom view of the mechanical pencil;
    FIG. 6 is a left side view of the mechanical pencil;
    FIG. 7 is a right side view of the mechanical pencil; and,
    FIG. 8 is an enlarged bottom view of the mechanical pencil.
    The parts shown in broken lines are portions of the mechanical pencil that form no part of the claimed design.

    WRITING INSTRUMENT AND METHOD FOR MANUFACTURING WRITING INSTRUMENT

    公开(公告)号:US20210162797A1

    公开(公告)日:2021-06-03

    申请号:US17169771

    申请日:2021-02-08

    摘要: A method for manufacturing a writing instrument includes inject molding a cushion spring of the writing instrument to form the cushion spring as one piece, and axially pushing out the cushion spring from a molding die set. The cushion spring elastically supports a tip of the writing instrument in an axial direction to a barrel of the writing instrument. The forming of the cushion spring includes forming a plurality of apertures in the cushion spring, one of the apertures being relatively arranged with another one of the apertures by rotations of angles at 90 degrees about the axial direction on an outer peripheral surface thereof, and forming a plurality of displacement regulating protrusions, one of the protrusions being relatively arranged with another one of the protrusions by rotations of angles at 90 degrees about the axial direction.

    Writing instrument
    6.
    发明授权

    公开(公告)号:US10293632B2

    公开(公告)日:2019-05-21

    申请号:US15974059

    申请日:2018-05-08

    IPC分类号: B43K21/16 B43K21/22

    摘要: A writing instrument according to an embodiment of the invention including, a chuck that chucks a writing lead, wherein the chuck includes a first chuck pawl which comes into point contact or line contact with the writing lead to press the writing lead so as to apply first contact stress to the writing lead; and a second chuck pawl which presses the writing lead so as to apply, to the writing lead, second contact stress that is lower than the first contact stress, and the first contact stress is configured such that, when a prescribed impact is applied to the writing lead, a contact portion of the writing lead subjected to the first contact stress fractures and absorbs the prescribed impact.

    Writing instrument
    7.
    外观设计

    公开(公告)号:USD998038S1

    公开(公告)日:2023-09-05

    申请号:US29735220

    申请日:2020-05-19

    摘要: FIG. 1 is a perspective view of a writing instrument, showing our new design;
    FIG. 2 is a front view of the writing instrument;
    FIG. 3 is a rear view of the writing instrument;
    FIG. 4 is a top view of the writing instrument;
    FIG. 5 is a bottom view of the writing instrument;
    FIG. 6 is a left side view of the writing instrument;
    FIG. 7 is a right side view of the writing instrument; and,
    FIG. 8 is an enlarged bottom view of the writing instrument.
    The parts shown in broken lines are portions of the mechanical pencil that form no part of the claimed design.

    Writing instrument
    9.
    发明授权

    公开(公告)号:US10343446B2

    公开(公告)日:2019-07-09

    申请号:US15974059

    申请日:2018-05-08

    IPC分类号: B43K21/16 B43K21/22

    摘要: A writing instrument according to an embodiment of the invention including, a chuck that chucks a writing lead, wherein the chuck includes a first chuck pawl which comes into point contact or line contact with the writing lead to press the writing lead so as to apply first contact stress to the writing lead; and a second chuck pawl which presses the writing lead so as to apply, to the writing lead, second contact stress that is lower than the first contact stress, and the first contact stress is configured such that, when a prescribed impact is applied to the writing lead, a contact portion of the writing lead subjected to the first contact stress fractures and absorbs the prescribed impact.