公开(公告)号：US20210091335A1

公开(公告)日：2021-03-25

申请号：US17116687

申请日：2020-12-09

Applicant: LG Display Co., Ltd.

Inventor： Dong-Jin KIM ,  Jae-Woon BAEK

IPC: H01L51/52 ,  H01L27/32

Abstract: An organic light-emitting display device is provided. The organic light-emitting display device includes an upper substrate coupling a lower substrate by an encapsulating layer. The upper substrate includes a metal. An inclined surface is formed at an edge of a substrate of the upper substrate by a rotating polishing wheel. Thus, in the organic light-emitting display device, the reliability may be prevented from being decreased by the metal burr without lowering the process efficiency and uniformity.

公开(公告)号：US20210119173A1

公开(公告)日：2021-04-22

申请号：US17116807

申请日：2020-12-09

Applicant: LG Display Co., Ltd.

Inventor： Dong-Jin KIM ,  Jae-Woon BAEK

IPC: H01L51/52 ,  H01L27/32

Abstract: An organic light-emitting display device is provided. The organic light-emitting display device includes an upper substrate coupling a lower substrate by an encapsulating layer. The upper substrate includes a metal. An inclined surface is formed at an edge of a substrate of the upper substrate by a rotating polishing wheel. Thus, in the organic light-emitting display device, the reliability may be prevented from being decreased by the metal burr without lowering the process efficiency and uniformity.

公开(公告)号：US20180336817A1

公开(公告)日：2018-11-22

申请号：US15985919

申请日：2018-05-22

Applicant: LG Display Co., Ltd.

Inventor： Dong-Jin KIM ,  Jae-Woon BAEK

IPC: G09G3/3208 ,  H05K1/18 ,  H01L51/52

Abstract: An organic light-emitting display device is provided. The organic light-emitting display device includes an upper substrate coupling a lower substrate by an encapsulating layer. The upper substrate includes a metal. An inclined surface is formed at an edge of a substrate of the upper substrate by a rotating polishing wheel. Thus, in the organic light-emitting display device, the reliability may be prevented from being decreased by the metal burr without lowering the process efficiency and uniformity.