公开(公告)号：US20230137868A1

公开(公告)日：2023-05-04

申请号：US17973329

申请日：2022-10-25

Applicant: LG ELECTRONICS INC.

Inventor： Dong Hun KIM ,  Dong kwan YU

IPC: H05B6/12 ,  H05B6/64 ,  H05K9/00

Abstract: A cooling appliance is proposed. A cavity (S) may be provided inside a casing (100, 200). A first heat source module (400) may be arranged in the casing (100, 200) and emit microwaves. A second heat source module (500) may be arranged at a bottom surface of the casing (100, 200) and emit magnetic fields. In addition, the second heat source module (500) may include a base plate (510) having a base hole (512) that is open at a center portion thereof, and a supporter (520) arranged below the base plate (510). A coil assembly (550) may be arranged between base plate (510) and the supporter (520). At this point, a shield filter (540) of the second heat source module (500) covers a working coil (570) of the coil assembly (550), and an outer end of the shield filter (540) may be arranged between the base plate (510) and a coil base (560).