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公开(公告)号:US08932069B2
公开(公告)日:2015-01-13
申请号:US13693365
申请日:2012-12-04
Applicant: LG Electronics Inc.
Inventor: Kyoungtae Kim , Soonsung Kwon , Minho Park , Doohwan Jo , Sangchul Jeon
CPC classification number: H01R13/73 , H01R12/7058 , H01R12/721 , H01R13/4538 , H01R2201/16 , H04M1/026 , H04M1/0274
Abstract: A terminal in accordance with one exemplary embodiment of the present disclosure includes a terminal body, a substrate mounted onto the terminal body, and a socket module coupled to the substrate to transfer an electrical signal by being electrically connected to an inserted plug, and the socket module includes a housing having an opening at one surface thereof, the plug being inserted into the opening, and a coupling unit formed at at least one side of the housing, and slidable with respect to the substrate upon being coupled to the substrate. This may allow a substrate assembly coupled with the socket module to become slimmer by a thickness of the substrate, resulting in providing a more size-reduced terminal.
Abstract translation: 根据本公开的一个示例性实施例的端子包括终端主体,安装到终端主体上的基板和耦合到基板的插座模块,以通过电连接到插入的插头来传送电信号,并且插座 模块包括在其一个表面上具有开口的壳体,插头插入到开口中,以及耦合单元,形成在壳体的至少一侧,并且在耦合到基板时可相对于基板滑动。 这可以允许与插座模块耦合的衬底组件变得更薄以减小衬底的厚度,从而提供更大尺寸减小的端子。
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公开(公告)号:US20130143435A1
公开(公告)日:2013-06-06
申请号:US13693365
申请日:2012-12-04
Applicant: LG ELECTRONICS INC.
Inventor: Kyoungtae Kim , Soonsung Kwon , Minho Park , Doohwan Jo , Sangchul Jeon
IPC: H01R13/73
CPC classification number: H01R13/73 , H01R12/7058 , H01R12/721 , H01R13/4538 , H01R2201/16 , H04M1/026 , H04M1/0274
Abstract: A terminal in accordance with one exemplary embodiment of the present disclosure includes a terminal body, a substrate mounted onto the terminal body, and a socket module coupled to the substrate to transfer an electrical signal by being electrically connected to an inserted plug, and the socket module includes a housing having an opening at one surface thereof, the plug being inserted into the opening, and a coupling unit formed at at least one side of the housing, and slidable with respect to the substrate upon being coupled to the substrate. This may allow a substrate assembly coupled with the socket module to become slimmer by a thickness of the substrate, resulting in providing a more size-reduced terminal.
Abstract translation: 根据本公开的一个示例性实施例的端子包括终端主体,安装到终端主体上的基板和耦合到基板的插座模块,以通过电连接到插入的插头来传送电信号,并且插座 模块包括在其一个表面上具有开口的壳体,插头插入到开口中,以及耦合单元,形成在壳体的至少一侧,并且在耦合到基板时可相对于基板滑动。 这可以允许与插座模块耦合的衬底组件变得更薄以减小衬底的厚度,从而提供更大尺寸减小的端子。
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