公开(公告)号：US20210329815A1

公开(公告)日：2021-10-21

申请号：US17033353

申请日：2020-09-25

Applicant: LG ELECTRONICS INC.

Inventor： Kwangsoo KIM ,  Seongmoo CHO ,  Oksun YU ,  Hyunsi HWANG ,  Siho CHOI ,  Gun LEE

IPC: H05K7/20 ,  H02M1/32 ,  H02M7/537

Abstract: The present disclosure relates to an electric power module and an inverter apparatus having the same. The electric power module of the present disclosure may include a power device that converts the frequency of input power for output; a housing in which a passage of cooling fluid is disposed to accommodate the power device therein, and a cooling member, one side of which is in direct heat exchange with the power device, and the other side of which is in direct heat exchange with the cooling fluid, wherein the cooling member is made of a metal foam having a multi-porous structure. As a result, it may be possible to increase a heat transfer area of the heat conductor, and suppress the occurrence of pressure loss in the cooling fluid.

公开(公告)号：US20210243923A1

公开(公告)日：2021-08-05

申请号：US17035263

申请日：2020-09-28

Applicant: LG ELECTRONICS INC.

Inventor： Hyunsi HWANG ,  Seongmoo CHO ,  Kwangsoo KIM ,  Siho CHOI ,  Gun LEE

IPC: H05K7/20

Abstract: A power module assembly is disclosed. A power module assembly according to an embodiment includes a module housing part having a power module, and an upper cover part and a lower cover part disposed to cover upper and lower sides of the module housing part, respectively, and defining a flow path part, through which cooling water flows, in spaces apart from the module housing part. The module housing part exposes a part of the power module on the flow path part. With the configuration, the cooling water can flow in direct contact with the power module, thereby more improving heat dissipation performance of the power module assembly.