公开(公告)号：US10931007B2

公开(公告)日：2021-02-23

申请号：US16287769

申请日：2019-02-27

Applicant: LG ELECTRONICS INC.

Inventor： Woojoon Roh ,  Jihoon Hwang ,  Donghwi Son ,  Daeyong Seong ,  Byoungnam Kim

IPC: H01Q1/40 ,  H01Q1/36 ,  H01Q1/24

Abstract: Provided are an antenna module for 5G communication, a manufacturing method thereof, and an electronic device including the antenna module. The antenna module includes an antenna body having a space formed therein, a plated layer plated on an inner surface of the antenna body, and a pore member formed on an outer surface of the antenna body and having an dielectric constant lower than that of the antenna body, wherein a thickness of the antenna body is smaller than a thickness of the pore member.

公开(公告)号：US20190393593A1

公开(公告)日：2019-12-26

申请号：US16287769

申请日：2019-02-27

Applicant: LG ELECTRONICS INC.

Inventor： Woojoon Roh ,  Jihoon Hwang ,  Donghwi Son ,  Daeyong Seong ,  Byoungnam Kim

IPC: H01Q1/40 ,  H01Q1/24 ,  H01Q1/36

Abstract: Provided are an antenna module for 5G communication, a manufacturing method thereof, and an electronic device including the antenna module. The antenna module includes an antenna body having a space formed therein, a plated layer plated on an inner surface of the antenna body, and a pore member formed on an outer surface of the antenna body and having an dielectric constant lower than that of the antenna body, wherein a thickness of the antenna body is smaller than a thickness of the pore member.