公开(公告)号：US12015890B2

公开(公告)日：2024-06-18

申请号：US17432861

申请日：2020-02-21

Applicant: LG ELECTRONICS INC.

Inventor： Hwoasu Jeong ,  Yonggeun Jin ,  Joonwon Bhang

IPC: H04R1/02 ,  A46B13/02

CPC classification number: H04R1/028 ,  A46B13/023 ,  H04R1/025 ,  H04R1/026 ,  A46B2200/1006

Abstract: Discussed is a device including a case having a receiving space formed therein; a cover configured to surround the case; a speaker assembly configured to be mounted on the case, the speaker assembly including a speaker, a diaphragm, and a resonator formed on one side of the speaker; and a speaker hole configured to be connected to the speaker assembly, wherein the case includes at least one opening formed between the resonator and a space between the cover and the case.