公开(公告)号：US20220169807A1

公开(公告)日：2022-06-02

申请号：US17536604

申请日：2021-11-29

Applicant: LG ELECTRONICS INC.

Inventor： Junseok LEE ,  Dongjoo YOU ,  Seongmoon CHO ,  Jinkyun LEE ,  Seongsoo CHOI

IPC: C08J5/18 ,  C08K3/36 ,  C08K7/26

Abstract: The present invention is applicable to a field of a substrate for a high-frequency circuit, and relates, for example, to a composite polyimide film, a producing method thereof, and a printed circuit board using the same. More specifically, the composite polyimide film includes a film matrix including polyimide; and a plurality of filler particles dispersed in the film matrix, wherein each of the filler particles includes an inorganic particle, and a fluorine polymer coating formed on the inorganic particle.