公开(公告)号：US20200232853A1

公开(公告)日：2020-07-23

申请号：US16305747

申请日：2016-08-24

Applicant: LG ELECTRONICS INC.

Inventor： Hyojin Nam ,  Kyoungwoo Jo ,  Mangeun Kim ,  Seungwoo Ham

IPC: G01J5/20 ,  G01J5/08

Abstract: A non-contact type infrared temperature sensor module according to an embodiment of the present invention can comprise: a case of which a portion of an upper surface is opened and having an accommodation space formed therein; a base having an upper surface coupled to the case; a cover window provided on the upper surface of the case and sealing the opened portion of the case; an infrared temperature sensor provided on the upper surface of the base and sensing the temperature of an object by receiving light transmitted from the cover window; and a first capping unit coupled to an upper portion of the infrared temperature sensor and blocking heat transmitted from the accommodation space.