公开(公告)号：US20230343505A1

公开(公告)日：2023-10-26

申请号：US18022327

申请日：2021-08-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Hwan KIM ,  Yu Seon KIM ,  Seok BAE

IPC: H01F27/28 ,  H01F17/00 ,  H05K1/16

CPC classification number: H01F27/2804 ,  H01F17/0006 ,  H05K1/165 ,  H01F2017/0073

Abstract: The present invention relates to a magnetic coupling device that can become slim and a circuit board including same. A magnetic coupling device according to one embodiment of the present invention comprises: a core unit including an upper core and a lower core; and a coil unit of which a part is arranged in the core unit, and which includes a first coil unit and a second coil unit, wherein the first coil unit and the second coil unit have a substrate and conductive patterns arranged on both surfaces of the substrate, and the conductive patterns on both surfaces can be conducted through a plurality of via holes arranged in the extending direction of the conductive patterns.