公开(公告)号：US20230407486A1

公开(公告)日：2023-12-21

申请号：US18036313

申请日：2021-09-30

Applicant: MEC COMPANY LTD.

Inventor： Yu FUKUI ,  Daisaku AKIYAMA ,  Dai NAKANE ,  Kenji NISHIE

IPC: C23F1/18 ,  C23F11/12 ,  C23F11/14 ,  H05K3/06

CPC classification number: C23F1/18 ,  C23F11/12 ,  C23F11/14 ,  H05K3/06

Abstract: The present invention includes an etching agent that selectively etches a copper layer of a processing target in which a noble metal layer containing a metal nobler than copper and the copper layer coexist, the etching agent including: a copper ion; one or more nitrogen-containing compounds selected from the group consisting of a heterocyclic compound having two or more nitrogen atoms in a ring and an amino group-containing compound having 8 or less carbon atoms; a polyalkylene glycol; and a halogen ion, in which the polyalkylene glycol is contained in an amount of 0.0005% by weight or more and 7% by weight or less, and the halogen ion is contained in an amount of 1 ppm or more and 250 ppm or less.