公开(公告)号：US20140049250A1

公开(公告)日：2014-02-20

申请号：US13828628

申请日：2013-03-14

Applicant: MKS INSTRUMENTS, INC.

Inventor： Dennis M. BROWN ,  David J. COUMOU ,  Raymond BROOKS

IPC: G01R19/00

CPC classification number: G01R19/00 ,  G01R15/181 ,  H01F27/2804 ,  H01F38/30 ,  H01F2038/305 ,  H05H1/46 ,  H05H2001/4682

Abstract: A radio frequency sensor system includes a printed circuit board (PCB). The PCB includes a first exterior layer, a second exterior layer, a first interior layer, a second interior layer, and an inner perimeter that defines an aperture through the PCB. The PCB also includes a first loop. The first loop includes a first plurality of sensor pads coupled to a first plurality of vias by a first plurality of traces. The first plurality of sensor pads is arranged on the inner perimeter. The PCB also includes a second loop. The second loop includes a second plurality of sensor pads coupled to a second plurality of vias by a second plurality of traces. The second plurality of sensor pads is arranged on the inner perimeter. A core ring is embedded within the first interior layer proximal to the first plurality of sensor pads, the first plurality of vias, and the first plurality of traces. A center conductor, for carrying RF current, extends through the aperture. The first and second loops generate an electrical signal based on the first and second plurality of sensor pads, the first and second plurality of vias, the first and second plurality of traces, and the core ring.

Abstract translation: 射频传感器系统包括印刷电路板（PCB）。 PCB包括第一外部层，第二外部层，第一内部层，第二内部层和限定通过PCB的孔的内部周边。 PCB还包括第一个回路。 第一环包括通过第一多个迹线耦合到第一多个通孔的第一多个传感器焊盘。 第一组多个传感器垫布置在内周上。 PCB还包括第二个回路。 第二环路包括通过第二多个迹线耦合到第二多个通孔的第二多个传感器焊盘。 第二组传感器垫布置在内周上。 核心环被嵌入到靠近第一多个传感器焊盘，第一多个通孔和第一多个迹线的第一内部层内。 用于承载RF电流的中心导体延伸穿过孔。 第一和第二回路基于第一和第二多个传感器焊盘，第一和第二多个通孔，第一和第二多个迹线以及芯环产生电信号。