PEAK-LOAD COOLING OF ELECTRONIC COMPONENTS BY PHASE-CHANGE MATERIALS
    1.
    发明申请
    PEAK-LOAD COOLING OF ELECTRONIC COMPONENTS BY PHASE-CHANGE MATERIALS 审中-公开
    电子元件的峰值负载冷却通过相变材料

    公开(公告)号:US20090180250A1

    公开(公告)日:2009-07-16

    申请号:US12352286

    申请日:2009-01-12

    IPC分类号: H05K7/20

    摘要: Cooling device for electronic components, in particular for power electronics in an aircraft, comprising an energy storage device which is in heat-conducting communication with at least one electronic component which is to be cooled, and which storage device is in the form of a material which performs a change in phase on absorbing the waste heat from the at least one electronic component.

    摘要翻译: 用于电子部件的冷却装置,特别是用于飞机中的电力电子设备的冷却装置,包括与要冷却的至少一个电子部件进行导热连通的能量存储装置,以及哪个存储装置是材料形式 其在从至少一个电子部件吸收废热的同时进行相位改变。