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公开(公告)号:US20200261725A1
公开(公告)日:2020-08-20
申请号:US16780036
申请日:2020-02-03
Applicant: Medtronic, Inc.
Inventor: Zhongping Yang , Derek Young
Abstract: A lead-in-lead system may include a first implantable lead having a first electrode and a second implantable lead having a second electrode guided by the first implantable lead to an implantation site. The second electrode may be implanted in a patient's heart distal to the first electrode at the same implantation site or at a second implantation site. Various methods may be used to deliver the lead-in-lead system to one or more implantation sites including at the triangle of Koch for ventricle-from-atrium (VfA) therapy, at the right ventricular septal wall for dual bundle-branch pacing, or in the coronary vasculature for left side sensing and pacing.
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公开(公告)号:US11679265B2
公开(公告)日:2023-06-20
申请号:US16780036
申请日:2020-02-03
Applicant: Medtronic, Inc.
Inventor: Zhongping Yang , Derek Young
CPC classification number: A61N1/3684 , A61N1/0587 , A61B17/3468 , A61N1/362 , A61N1/3956
Abstract: A lead-in-lead system may include a first implantable lead having a first electrode and a second implantable lead having a second electrode guided by the first implantable lead to an implantation site. The second electrode may be implanted in a patient's heart distal to the first electrode at the same implantation site or at a second implantation site. Various methods may be used to deliver the lead-in-lead system to one or more implantation sites including at the triangle of Koch for ventricle-from-atrium (VfA) therapy, at the right ventricular septal wall for dual bundle-branch pacing, or in the coronary vasculature for left side sensing and pacing.
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