公开(公告)号：US20210170083A1

公开(公告)日：2021-06-10

申请号：US17107408

申请日：2020-11-30

Applicant: Medtronic, Inc.

Inventor： Kevin Seifert ,  Yong K. Cho ,  Michael D. Eggen ,  David J. Peichel ,  Thomas W. Radtke ,  Pankti Shah ,  Jason D. Hamack

IPC: A61M1/12 ,  H05K5/02 ,  H02J50/00 ,  H02J50/10

Abstract: Various embodiments of an implantable medical device and a method of implanting such device are disclosed. The device includes a housing having a first major surface, a second major surface, a sidewall that extends between the first major surface and the second major surface, and a port disposed in the sidewall. The sidewall defines a perimeter of the housing. The device further includes an electronic component disposed within the housing, and a cable electrically connected to the electronic component disposed within the housing, where the cable extends through the port. A portion of the cable is adapted to be removably connected to the housing adjacent an outer surface of the sidewall by a fastener such that the portion of the cable extends along at least a portion of the perimeter of the housing when the portion of the cable is removably connected to the housing.