Polymeric edge seal for bonded substrates
    1.
    发明授权
    Polymeric edge seal for bonded substrates 有权
    粘合基材的聚合物边缘密封

    公开(公告)号:US08613996B2

    公开(公告)日:2013-12-24

    申请号:US12603002

    申请日:2009-10-21

    IPC分类号: B32B7/00

    摘要: A layer of polymer material is applied on a peripheral region of at least one of the two substrates to be bonded prior to bonding. The bonded structure formed thereby includes a first substrate, a second substrate in direct contact with the first substrate, and a ring of the polymer material in direct contact with the first substrate at a first interface and in direct contact with the second substrate. The ring of polymer material laterally surrounds and seals the interface at which the first substrate contacts the second substrate. A ring-shaped cavity can be formed within the polymeric ring. Alternately, the first interface and the second interface can be contiguous without a ring-shaped cavity between the first and second substrates.

    摘要翻译: 在接合之前,将待结合的两个基板中的至少一个的外围区域上施加一层聚合物材料。 由此形成的接合结构包括第一基板,与第一基板直接接触的第二基板,以及在第一界面处与第一基板直接接触并与第二基板直接接触的聚合物材料的环。 聚合物材料环横向包围并密封第一基底与第二基底接触的界面。 可以在聚合物环内形成环形空腔。 或者,第一界面和第二界面可以相邻,而在第一和第二基板之间没有环形腔。

    POLYMERIC EDGE SEAL FOR BONDED SUBSTRATES
    2.
    发明申请
    POLYMERIC EDGE SEAL FOR BONDED SUBSTRATES 有权
    用于粘合基材的聚合物边缘密封

    公开(公告)号:US20110091685A1

    公开(公告)日:2011-04-21

    申请号:US12603002

    申请日:2009-10-21

    IPC分类号: B32B7/00 B32B37/00

    摘要: A layer of polymer material is applied on a peripheral region of at least one of the two substrates to be bonded prior to bonding. The bonded structure formed thereby includes a first substrate, a second substrate in direct contact with the first substrate, and a ring of the polymer material in direct contact with the first substrate at a first interface and in direct contact with the second substrate. The ring of polymer material laterally surrounds and seals the interface at which the first substrate contacts the second substrate. A ring-shaped cavity can be formed within the polymeric ring. Alternately, the first interface and the second interface can be contiguous without a ring-shaped cavity between the first and second substrates.

    摘要翻译: 在接合之前,将待结合的两个基板中的至少一个的外围区域上施加一层聚合物材料。 由此形成的接合结构包括第一基板,与第一基板直接接触的第二基板,以及在第一界面处与第一基板直接接触并与第二基板直接接触的聚合物材料的环。 聚合物材料环横向包围并密封第一基底与第二基底接触的界面。 可以在聚合物环内形成环形空腔。 或者,第一界面和第二界面可以相邻,而在第一和第二基板之间没有环形腔。