MULTILAYERED CAVITY STRUCTURES, AND METHODS OF MANUFACTURE THEREOF

    公开(公告)号:US20220059917A1

    公开(公告)日:2022-02-24

    申请号:US17299339

    申请日:2019-12-05

    Applicant: NIMROD ROSPSHA

    Inventor: NIMROD ROSPSHA

    Abstract: A cavity device is disclosed comprising a plurality of flat boards stacked one on lop of the other to form a multilayered structure. At least some of the flat boards comprise at least one opening or perforations having one or more layers of electrically conducting materials configured to establish electrical conduction with one or more layers of electrically conducting materials of another one of the flat boards, to thereby form electrically conducting patterns in the multilayered structure for interacting with electromagnetic radiation introduced into the cavity device.

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