公开(公告)号：US10893608B2

公开(公告)日：2021-01-12

申请号：US16105900

申请日：2018-08-20

Applicant: National Taipei University of Technology

Inventor： Tzu-Wei Chou ,  Syang-Peng Rwei ,  Chien-Cheng Chen ,  Guo-Ming Sung

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/03 ,  H05K1/18 ,  H05K3/32 ,  H05K3/46 ,  B33Y80/00 ,  H05K1/02 ,  H05K1/09 ,  H05K3/12 ,  H05K3/28

Abstract: The present invention provides a fabric having a multiple layered circuit thereon integrating with electronic devices. The fabric comprises: a base layer; a plurality of conductive circuit layers; at least one connecting layer having electrically-conductive via-hole(s) and electrically-insulated area covering the area without the via-hole(s) and electrically connecting two conductive circuit layers through the via-hole(s) but electrically insulating the rest of the two conductive circuit layers; one or more than one electrical devices mounted to the conductive circuit layer and connected to circuits on the conductive circuit layer through anisotropic conductive film (ACF); and a water-proof layer disposed on the conductive circuit layer which is the farthest away from the base layer and covering the electrical device(s).

公开(公告)号：US20190069407A1

公开(公告)日：2019-02-28

申请号：US16105900

申请日：2018-08-20

Applicant: National Taipei University of Technology

Inventor： Tzu-Wei CHOU ,  Syang-Peng Rwei ,  Chien-Cheng Chen ,  Guo-Ming Sung

IPC: H05K1/11 ,  H05K3/28 ,  H05K1/09 ,  H05K1/03 ,  H05K1/18 ,  H05K3/32 ,  H05K3/12 ,  H05K1/02 ,  H05K3/46

Abstract: The present invention provides a fabric having a multiple layered circuit thereon integrating with electronic devices. The fabric comprises: a base layer; a plurality of conductive circuit layers; at least one connecting layer having electrically-conductive via-hole(s) and electrically-insulated area covering the area without the via-hole(s) and electrically connecting two conductive circuit layers through the via-hole(s) but electrically insulating the rest of the two conductive circuit layers; one or more than one electrical devices mounted to the conductive circuit layer and connected to circuits on the conductive circuit layer through anisotropic conductive film (ACF); and a water-proof layer disposed on the conductive circuit layer which is the farthest away from the base layer and covering the electrical device(s).