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公开(公告)号:US11433637B2
公开(公告)日:2022-09-06
申请号:US16638684
申请日:2017-08-14
发明人: Yuka Suzuki , Yutaka Mabuchi , Takuma Suzuki , Ken Tsutsuji
摘要: A heat shield component includes a substrate, and a heat shield film arranged on the substrate. The heat shield film includes a first layer arranged on the substrate, including pores, and having a thermal conductivity of 0.3 W/(m·K) or less and a volumetric specific heat of 1200 kJ/(m3·K) or less, and a second layer arranged on the first layer to provide closed pores between the first layer and the second layer. The heat shield film has a surface roughness on a top surface which is 1.5 μm Ra or less. The heat shield component can achieve high heat-insulating properties and an improved effect of reducing the emission amount of hydrocarbon in an internal combustion engine, for example.
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公开(公告)号:US20210187909A1
公开(公告)日:2021-06-24
申请号:US16638684
申请日:2017-08-14
发明人: Yuka Suzuki , Yutaka Mabuchi , Takuma Suzuki , Ken Tsutsuji
IPC分类号: B32B15/088 , B32B15/20 , F02F1/00 , C23C28/04
摘要: A heat shield component includes a substrate, and a heat shield film arranged on the substrate. The heat shield film includes a first layer arranged on the substrate, including pores, and having a thermal conductivity of 0.3 W/(m·K) or less and a volumetric specific heat of 1200 kJ/(m3·K) or less, and a second layer arranged on the first layer to provide closed pores between the first layer and the second layer. The heat shield film has a surface roughness on a top surface which is 1.5 μm Ra or less. The heat shield component can achieve high heat-insulating properties and an improved effect of reducing the emission amount of hydrocarbon in an internal combustion engine, for example.
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